NEW YORK, July 25, 2021 /PRNewswire/ —
The global wafer dicing saws market is expected to grow by USD 91.16 million during 2021-2025, according to Technavio’s latest market report. Based on our research, the Semiconductor Equipment sector witnessed a Mixed impact due to the widespread growth of the COVID-19 pandemic. The report also throws light on the pre- and post-impact of COVID-19 on businesses.
The wafer dicing saws market share growth by the pureplay foundries segment has been significant and is expected to provide significant growth opportunities to market vendors.
86% of the market’s growth will originate from APAC during the forecast period. Taiwan, South Korea (Republic of Korea), Japan, and China are the key markets for wafer dicing saws market in APAC.
APAC has been recording a significant growth rate and is expected to offer several business opportunities to market vendors during the forecast period. One of the key factors driving the growth in APAC is the increase in the number of mobile devices, smart devices, and smart cards.
Wafer Dicing Saws Market: Major Growth Drivers
The wafer dicing saws market report the following factors as major growth drivers during the forecast period:
- Growing demand for IoT
- Increase in the number of mobile devices, smart devices, and smart cards
- Increasing in the number of fabs
The report helps businesses create strategies to make the most of future growth opportunities.
Wafer Dicing Saws Market: Key Vendor Offerings
Advanced Dicing Technologies
Advanced Dicing Technologies operates its business under segments- Dicing Saws, Dicing Blades, Peripheral Equipment, and Dicing Accessories. The company offers a wide range of wafer dicing saws such as 8000 series, 8020 series, and others.
DISCO Corp. operates its business under segments- Precision Processing Equipment, Consumables, Maintenance parts, Others, and Industrial Products. The company offers wafer dicing saws such as DFD6240, DFD6450, DFD6363, DAD324, and others.
Dynatex International operates its business under segments- Dicing surfactant, Scribe and break, Scribe and Break Consumables, StripAid Solvent, Surfactant Dispensers, Wafer Bonders, Wafer Expanders, WaferGrip Adhesives, and WaferWipes. The company offers wafer dicing saws such as DTX Scribe and Break, and GSX.
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Reasons to Buy Wafer Dicing Saws Market Report:
- CAGR of the market during the forecast period 2021-2025
- Detailed information on factors that will assist wafer dicing saws market growth during the next five years
- Estimation of the wafer dicing saws market size and its contribution to the parent market
- Predictions on upcoming trends and changes in consumer behavior
- The growth of the wafer dicing saws market across APAC, North America, Europe, South America, and MEA
- Analysis of the market’s competitive landscape and detailed information on vendors
- Comprehensive details of factors that will challenge the growth of wafer dicing saws market vendors
Our experts can help your businesses with a tailor-made report to suit requirements.
Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions. With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.
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