Mitsubishi Electric to Launch “SLIMDIP-Z” Power Semiconductor Module

TOKYO–()–Mitsubishi Electric Corporation (TOKYO:6503) announced today that its new SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter systems of home appliances, will be released in February 2023. The compact module will enable the SLIMDIPTM series to meet a wider range of power and size needs for inverter units, specifically by simplifying and downsizing systems for multifunctional and sophisticated products such as air conditioners, washing machines and refrigerators.

The demand is growing for power semiconductors capable of efficiently converting electric power to help realize a low-carbon world. In 1997, Mitsubishi Electric commercialized its first DIPIPMTM as a high-performance intelligent power module with a transfer-mold structure incorporating a switching device and a control IC to drive and protect the switching element. Since then, DIPIPMs have been widely adapted for use in large appliances and inverters for industrial motors, contributing to the downsizing and energy-efficiency of inverter boards.

Product Features

1) Extra-high 30A rated current will enable simpler, smaller inverter systems for appliances

  • Optimized frame shape expands Reverse Conducting IGBT (RC-IGBT) chip’s mounting area.
  • Insulation sheet reduces thermal resistance between chip junction and case by about 40% compared to existing SLIMDIP-L, which allowed the rated current to be increased to 30A.
  • RC-IGBT temperature suppression will help to simplify and downsize the thermal designs of inverter systems.

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